ニュース本文
Central News Agency(CNA) - Benefiting from the theme of Fan-Out Panel Level Packaging (FOPLP) technology, Innolux closed at the daily limit of NT$64.4 today, surpassing its previous high of NT$60.5 from early June and reaching a new record. AUO closed at NT$28.15, a significant increase of 7.24%.Fan-Out Panel Level Packaging concept stocks also saw gains. TSMC closed at NT$2410, up NT$25, a 1.05% increase. ASE Technology Holding closed at NT$613, up NT$18, a 3.03% increase. Powertech Technology closed at NT$363.5, up NT$18.5, a 5.36% increase.Equipment manufacturers also performed well. Manz closed at NT$1235, up NT$80, a gain of 6.93%. Giga Solar closed at NT$599, up NT$19, a 3.28% increase.Research firm TrendForce indicated that the explosive demand for AI semiconductors is driving the rapid evolution of advanced packaging technologies, with Fan-Out Panel Level Packaging (FOPLP) becoming a new battleground for various players.TrendForce stated that TSMC is currently focusing on Chip-on-Panel-on-Substrate (CoPoS) technology, targeting a substrate size of 310x310 mm. 2026 will be a critical verification period for related equipment and material suppliers, with trial production expected in 2027 and mass production planned for the second half of 2028. The next phase of strategic focus will shift to Glass Core Substrate technology, with mass production tentatively estimated after 2030. (Editor: Yang Kai-hsiang) 0618Stand with facts, your every contribution is a force to protect press freedom.Download the CNA "One-Stop News" APP to get the latest news in real-time.No reproduction, public broadcast, public transmission, or utilization of the text, images, or videos on this website is permitted without authorization.