Starting from July 29th, a 3-month consecutive training program by AndTech: "Basics, Evaluation, Selection, and Latest Technologies of Tape Materials in Semiconductor Backgrinding/Dicing Processes [3-Month Training: Web Live & Archived Lectures]"
AI Summary (NQ-processed)
AndTech is launching a specialized training program on tape materials used in semiconductor backgrinding/dicing processes. The training will be held over three months, systematically covering the basics to the latest technologies of adhesive tapes, backgrinding tapes, and dicing tapes.
AI Analysis
Frequently Asked Questions
Q: What is the purpose of this training?
A: The purpose of this training is to systematically learn the basics to the latest technology of tape materials in semiconductor backgrinding/dicing processes and to acquire knowledge that can be applied in practice.
Q: How long is the training period?
A: The training is held continuously for 3 months, consisting of a total of 3 lectures.
Q: Who is the target audience for this training?
A: This training is targeted at technicians and researchers involved in semiconductor manufacturing and related processes.
Q: What is the format of the training?
A: The training is conducted in the form of web live streaming and archived video viewing.
Q: Who is the instructor for this training?
A: The instructor for this training is Shinya Taguchi from Lintec Corporation.