Cadence announced an expanded partnership with TSMC to drive AI-driven semiconductor innovation. The collaboration introduces 'agent-ready' design flows optimized for TSMC's N3, N2, A16, and A14 process nodes. By integrating agent-based AI into EDA tools, the partnership aims to improve PPA, reliability, and productivity for advanced AI and HPC chips, while providing a comprehensive IP portfolio including HBM4E and PCIe 6.0.